PROCESS ENGINEER - LEUVEN (BELGIUM) - PERMANENT POSITION
We're currently recruiting a hands-on Process Engineer to join a company based in Leuven, as part of their microelectronics manufacturing team.
In this role, you will be responsible for developing, optimizing, and troubleshooting assembly and packaging processes for high-performance microelectronic devices. You will work directly on the production floor, ensuring process stability, yield improvement, and product quality while supporting the introduction of new technologies and automation.
This role requires a strong background in microelectronics assembly, packaging techniques, and production process optimization. You will collaborate with operators, equipment engineers, and R&D teams to ensure efficient and reliable manufacturing processes.
Key Responsibilities:
* Develop and refine assembly and packaging processes for microelectronic components, including die attach, wire bonding, flip-chip bonding, encapsulation, and hermetic sealing.
* Establish and maintain process parameters, work instructions, and standard operating procedures (SOPs) to ensure consistent production quality.
* Identify and implement continuous improvement initiatives, focusing on process stability, efficiency, and cost reduction.
* Provide hands-on support for daily production activities, ensuring minimal downtime and high yield.
* Analyze process failures, defects, and yield loss, identifying root causes and implementing corrective actions.
* Work closely with equipment engineers and operators to ensure smooth operation of assembly and packaging tools.
* Collaborate with equipment teams to qualify, maintain, and optimize production equipment.
* Evaluate and qualify materials, adhesives, and bonding agents to ensure compatibility with production processes.
* Support automation initiatives to enhance process repeatability and throughput.
* Work with quality teams to investigate non-conformances and implement corrective actions.
Qualifications & Skills:
* Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
* 3+ years of hands-on experience in microelectronics assembly, packaging, or semiconductor manufacturing.
* Strong knowledge of die attach, wire bonding (gold, copper, aluminum), flip-chip, epoxy dispensing, and encapsulation techniques.
* Experience with manufacturing process optimization, SPC, DOE, and failure analysis.
* Hands-on experience with bonding, dicing, pick-and-place, reflow soldering, or cleanroom processes.
* Familiarity with automation, robotics, and lean manufacturing principles is a plus.
* Strong problem-solving and analytical skills, with a proactive, hands-on approach to troubleshooting.
The Offer:
* Work in a cutting-edge microelectronics manufacturing environment.
* Opportunity to drive process innovation and influence next-generation packaging technologies.
* Competitive salary, benefits, and opportunities for career growth in advanced electronics manufacturing.
Please send over your CV to tom.walker@vividresourcing.com or call me on +32 (0) 3 318 00 74. As always, we are open to recommendations, so please feel free to pass this on to other suitable candidates.