? 3D Integration Program Director – Next-Gen Tech Leadership
? Belgium | Full-time | Employee Role
We’re partnering with a leading R&D powerhouse to find a 3D Integration Program Director—a newly created, high-impact role for a PhD-level expert ready to define the future of 3D IC technologies in AI, telecom, and semiconductor systems.
If you're looking for a blank canvas with executive support to build something groundbreaking—this is it.
What You’ll Do:
* Define and lead the strategy for 3D integration within the global R&D framework.
* Shape the roadmap for chip-to-chip integration, advanced packaging, and heterogeneous systems.
* Scout innovation in AI/CPU, telecom, and HPC, and turn tech concepts into commercial breakthroughs.
* Coordinate cross-functional teams across research, supply chain, and manufacturing.
* Establish a new team as the program grows—this starts with you.
What You Bring:
* PhD in Engineering, Materials Science, or related field.
* 10+ years in 3D IC, semiconductor packaging, or integration technologies.
* Proven ability to drive complex R&D programs with technical and strategic oversight.
* Experience in CAD tools, simulation, and testing platforms for chip design/integration.
* Strong leadership and communication skills in cross-cultural, multi-stakeholder environments.
Why This Role?
* This isn’t an operational handover—it’s a strategic build-up from scratch.
* You’ll set the direction for a core research pillar aligned with next-gen AI and 5G systems.
* Backed by senior leadership, you'll influence high-level R&D investments and future product strategy.
Ready to define what's next in 3D integration?
Apply now and lead a high-stakes, high-visibility program from day one.
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