IC Package Development Engineer
You will optimize the design of an integrated circuit (IC) package to enhance its performance and reliability.
Key Responsibilities:
* Select an appropriate IC package type based on specifications and IC requirements, analyzing its electrical characteristics and identifying potential issues.
* Optimize electrical performance by focusing on signal integrity, power integrity, and electromagnetic compatibility (EMC), proposing design modifications to improve performance.
* Consider manufacturability and cost optimization aspects, reviewing the design for manufacturing processes, assembly requirements, and materials availability, suggesting modifications to streamline the process while maintaining or reducing costs.
* Produce a comprehensive report summarizing analysis, design modifications, and optimization recommendations, including diagrams, simulations, calculations, and experimental results where applicable.
About You:
* MSc in electronics or equivalent, with at least 5 years of experience in packaging design and SIPI analysis.
* Knowledge in Cadence layout tool.
* Knowledge in Ansys tool.
* Knowledge in 2.5D/3D packaging, backend silicon layout (place & route).
* English language proficiency is required.