BEOL Integration R&D Engineer – Platform & Operations Efficiency TeamBEOL Integration R&D Engineer – Platform & Operations Efficiency TeamJoin the Platform Efficiency Team at imec's R&D headquarters located in the heart of Europe and help strengthen technology and modules across imec’s many programs. The Platform Efficiency Department is part of the Platform & Operations Efficiency Team and is responsible for the integration and project management efforts for both small modules and full flows.ResponsibilitiesWork in the Platform Efficiency Department as a BEOL Integration Engineer.Flow platformization of a wide range of flows, including advanced CMOS, Si Photonics, 3D integration, and Tech Transfer needs. Drive improvement in consistency, uniformity, and stability.Module Synergy activity: working on modules used across several programs at IMEC to provide consistently effective results.Support 28nm and 14nm technology flows at IMEC, strengthening performance and stability while collaborating with customers for technology transfers.Set up and carry out development plans, including defining design of experiments and analyzing incoming data.Discuss process splits with characterization and/or process step development engineers.Leverage industry experience to window and corner test modules, establishing optimal settings across major program families.What we do for youWe offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion, and expertise, you’ll become part of a team that makes the impossible possible.We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment. We invest in your development to further your technical and personal growth.Your contribution makes imec a top player in its field, and we appreciate your energy and commitment with a market-appropriate salary and many fringe benefits.Who you areMinimum Bachelor's Degree in Engineering or other science-based field; MS degree preferred.3+ years of industry experience in a production or development environment required.Direct experience in Logic or memory device Integration Engineering for BEOL structures/concepts.Desired experience with wafer bonding, die to wafer bonding, and chip interposers.Strong analytical skills with the ability to draw conclusions from data.Good time management skills and the ability to balance multiple activities.Excellent communication skills in English, both verbal and written.Willingness to relocate to Leuven, Belgium.
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