3D Integration Program Director – Lead Innovation in Telecom & AILocation: Leuven, BelgiumAre you an expert in 3D integration, semiconductor manufacturing, and cutting-edge materials? Ready to drive innovation in AI, 5G, and next-gen networking? We’re looking for a 3D Integration Program Director to lead high-impact R&D projects that shape the future of telecom and beyond!What You’ll Do:- Lead breakthrough projects in AI/CPU, networking, and 3D engineering.- Design and implement cutting-edge 3D engineering architectures.- Turn complex ideas into reality by managing risks and executing technical roadmaps.- Collaborate globally with top industry experts to push the boundaries of 3D technologies.- Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech.What You Bring:- PhD in Engineering, Materials Science, or a related field.- 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.- Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.- Strong leadership & communication skills to work with top-tier researchers and engineers.- A problem-solving mindset with the ability to manage complex, high-stakes projects.Why Join Us?- Work at the forefront of innovation in AI, 5G, and advanced networking.- Collaborate with global experts and lead game-changing research.- Be part of a company driving next-gen digital transformation.Are you ready to lead the future of 3D integration? Apply now and let’s innovate together!
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